IEEE - Institute of Electrical and Electronics Engineers, Inc. - EMI associated with inter-board connection for module-on-backplane and stacked-card configurations

Proceedings of 1999 International Symposium on Electromagnetic Compatibility (EMC'99)

Author(s): Ye, X. ; Nadolny, J. ; Drewniak, J.L. ; Hubing, T.H. ; Vaudoren, T.P. ; DuBroff, D.E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Seattle, WA, USA, USA
Conference Date: 2 August 1999
Volume: 2
ISBN (Paper): 0-7803-5057-X
DOI: 10.1109/ISEMC.1999.810121
Regular:

EMI associated with inter-board connection was studied through common-mode current measurements and FDTD modeling for stacked-card and module-on-backplane configurations. Three types of... View More

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