IEEE - Institute of Electrical and Electronics Engineers, Inc. - A comparison of air flow and shielding effectiveness of perforated enclosure panels

Proceedings of 1999 International Symposium on Electromagnetic Compatibility (EMC'99)

Author(s): Jackman, T. ; Ju, W. ; Gisin, F. ; Duckett, J. ; Evans, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Seattle, WA, USA, USA
Conference Date: 2 August 1999
Volume: 2
ISBN (Paper): 0-7803-5057-X
DOI: 10.1109/ISEMC.1999.810080
Regular:

The goals of the thermal engineer and EMC engineer often lead to contradictory design requirements. The EMC engineer wants smaller cooling openings to provide more attenuation of electromagnetic... View More

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