IEEE - Institute of Electrical and Electronics Engineers, Inc. - Measured surface transfer impedance of multi-pin Micro-D Subminiature and LFH/sup TM/ connector assemblies at frequencies up to 1 GHz

Proceedings of 1999 International Symposium on Electromagnetic Compatibility (EMC'99)

Author(s): Hoeft, L.O. ; Knighten, J.L. ; Ahmad, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Seattle, WA, USA, USA
Conference Date: 2 August 1999
Volume: 2
ISBN (Paper): 0-7803-5057-X
DOI: 10.1109/ISEMC.1999.810079
Regular:

Candidate connector assemblies were examined for use in high-speed digital interconnects, such as the Fibre Channel protocol. Twelve Micro-D Subminiature connector pair and 6 Low Force Helix... View More

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