IEEE - Institute of Electrical and Electronics Engineers, Inc. - SHEWMAC: an end-of-line SPC scheme for joint monitoring of process mean and variance

1999 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Author(s): Chih-Min Fan ; Shi-Chung Chang ; Ruey-Shan Guo ; Hui-Hung Kung ; Jyh-Cheng You ; Hsin-Pai Chen ; Lin, S. ; Wei, J.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Santa Clara, CA, USA, USA
Conference Date: 11 October 1999
Page(s): 233 - 236
ISBN (Paper): 0-7803-5403-6
ISSN (Paper): 1523-553X
DOI: 10.1109/ISSM.1999.808779
Regular:

Under the effects of multiple-stream and sequence-disorder, process change caused by one machine at an in-line step may result in changes in both the mean and variance of end-of-line wafer... View More

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