IEEE - Institute of Electrical and Electronics Engineers, Inc. - Reliability improvement of Semitool SAT-post CMP cleans

1999 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Author(s): Campbell, M.A. ; Tang, P.A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Santa Clara, CA, USA, USA
Conference Date: 11 October 1999
Page(s): 199 - 202
ISBN (Paper): 0-7803-5403-6
ISSN (Paper): 1523-553X
DOI: 10.1109/ISSM.1999.808771
Regular:

A brief overview of Chemical Mechanical Polishing (CMP) and post oxide polish wafer cleaning, and a summary of the tool reliability and process control improvements are presented in this paper.... View More

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