IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of a novel air-back wafer carrier with an integrated endpoint detector for copper CMP application

1999 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Author(s): Sakai, K. ; Doy, T.K. ; Touzov, M.M. ; Satoh, M. ; Kasai, T.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Santa Clara, CA, USA, USA
Conference Date: 11 October 1999
Page(s): 183 - 186
ISBN (Paper): 0-7803-5403-6
ISSN (Paper): 1523-553X
DOI: 10.1109/ISSM.1999.808767
Regular:

This study presents the development of a novel air-back polishing carrier with an integrated Linear Variable Differential Transformer Endpoint Detector (LVDT EPD). In the course of this study,... View More

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