IEEE - Institute of Electrical and Electronics Engineers, Inc. - Surface inspection system with automatic discrimination of microscratches and particles on chemical mechanical polished wafers

1999 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Author(s): Moriyama, I. ; Tanabe, Y. ; Ishimaru, I. ; Noguchi, M. ; Mizukami, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Santa Clara, CA, USA, USA
Conference Date: 11 October 1999
Page(s): 139 - 142
ISBN (Paper): 0-7803-5403-6
ISSN (Paper): 1523-553X
DOI: 10.1109/ISSM.1999.808757
Regular:

Microscratches and particles are becoming a serious problem associated with the introduction of CMP to IC-processing. This paper describes a new surface inspection system for a blank wafer with... View More

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