IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling yield throughout the DRAM product life cycle

1999 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Author(s): Simmons, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Santa Clara, CA, USA, USA
Conference Date: 11 October 1999
Page(s): 123 - 126
ISBN (Paper): 0-7803-5403-6
ISSN (Paper): 1523-553X
DOI: 10.1109/ISSM.1999.808753
Regular:

This paper presents a modeling technique for predicting DRAM die-per-wafer yield throughout a product's fabrication life cycle. Using manufacturing yield data, it is shown that an accurate mature... View More

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