IEEE - Institute of Electrical and Electronics Engineers, Inc. - Evaluation of the yield impact of epitaxial defects on advanced semiconductor technologies

1999 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings

Author(s): Williams, R. ; Chen, W. ; Akbulut, M. ; Tong, T.X.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Santa Clara, CA, USA, USA
Conference Date: 11 October 1999
Page(s): 107 - 110
ISBN (Paper): 0-7803-5403-6
ISSN (Paper): 1523-553X
DOI: 10.1109/ISSM.1999.808749
Regular:

The SPI/sup TB1/ defect inspection system was used to inspect epitaxial wafers for an advanced semiconductor manufacturing process to distinguish particles from epitaxial defects (e.g., stacking... View More

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