IEEE - Institute of Electrical and Electronics Engineers, Inc. - An even wiring approach to the ball grid array package routing

Proceedings. 1999 IEEE International Conference on Computer Design: VLSI in Computers and Processors. ICCD'99

Author(s): Shuenn-Shi Chen ; Jong-Jang Chen ; Chia-Chun Tsai ; Sao-Jie Chen
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Austin, TX, USA, USA
Conference Date: 10 October 1999
Page(s): 303 - 306
ISBN (Paper): 0-7695-0406-X
ISSN (Paper): 1063-6404
DOI: 10.1109/ICCD.1999.808555
Regular:

An even-wiring router for the BGA package is presented to interconnect each I/O pad of a chip to a corresponding ball distributed on the substrate area. The major phases for the router consist of... View More

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