IEEE - Institute of Electrical and Electronics Engineers, Inc. - Microstructure release and test techniques for high-temperature micro hotplate

Engineering Solutions for the Next Millennium. 1999 IEEE Canadian Conference on Electrical and Computer Engineering

Author(s): Grudin, O. ; Marinescu, R. ; Landsberger, L. ; Cheeke, D. ; Kahrizi, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Edmonton, Alberta, Canada, Canada
Conference Date: 9 May 1999
Volume: 3
ISBN (Paper): 0-7803-5579-2
ISSN (Paper): 0840-7789
DOI: 10.1109/CCECE.1999.804957
Regular:

We report several practical issues in the fabrication and high-temperature operation of micro suspended heating structures compatible with standard CMOS technology. Suspended microstructures are... View More

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