IEEE - Institute of Electrical and Electronics Engineers, Inc. - Simulation of predischarge processes in SF/sub 6//N/sub 2/ mixtures stressed by very fast transient voltages

Conference on Electrical Insulation and Dielectric Phenomena

Author(s): Pfeiffer, W. ; Schoen, D. ; Tong, L.Z.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Austin, TX, USA, USA
Conference Date: 17 October 1999
ISBN (Paper): 0-7803-5414-1
DOI: 10.1109/CEIDP.1999.804670
Regular:

This paper deals with the numerical simulation of discharge processes in SF/sub 6//N/sub 2/ mixtures. We introduce the particle-in-cell (PIC) method using a Monte Carlo collision module (MCC)... View More

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