IEEE - Institute of Electrical and Electronics Engineers, Inc. - Influence of epoxy system formulation on partial discharge behavior of resin impregnated coils

Conference on Electrical Insulation and Dielectric Phenomena

Author(s): Kaindl, A.F. ; Schoen, L. ; Borsi, H.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Austin, TX, USA, USA
Conference Date: 17 October 1999
ISBN (Paper): 0-7803-5414-1
DOI: 10.1109/CEIDP.1999.804630
Regular:

This paper discusses the influence of filler characteristics on the rheological behavior of different epoxy based casting resins. Low filler contents and large grain sizes result in low viscous... View More

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