IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of three dimensional ceramic-based MCM inductors for hybrid RF/microwave applications

1999 IEEE Radio Frequency Integrated Circuits Symposium

Author(s): Sutono, A. ; Pham, A. ; Laskar, J. ; Smith, W.R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Anaheim, CA, USA, USA
Conference Date: 14 June 1999
Page(s): 175 - 178
ISBN (Paper): 0-7803-5604-7
ISSN (Paper): 1097-2633
DOI: 10.1109/RFIC.1999.805265
Regular:

We present the design, development and characterization of planar and multilayer (3-D) inductor structures fabricated on a multi-layer ceramic-based Multi-Chip-Module (MCM-C) technology. We... View More

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