IEEE - Institute of Electrical and Electronics Engineers, Inc. - Ground bouncing analysis using a program linking FDTD and SPICE

Proceedings of 4th International Symposium on Electromagnetic Compatability

Author(s): Nishizawa, A. ; Shimazaki, M. ; Tanabe, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Tokyo, Japan, Japan
Conference Date: 17 May 1999
Page(s): 381 - 384
ISBN (Paper): 4-9980748-4-9
DOI: 10.1109/ELMAGC.1999.801344
Regular:

Ground bouncing noise was analyzed by a link program of finite difference time domain (FDTD) and SPICE. In this program, the electric characteristics of buffer ICs is computed by SPICE, whereas... View More

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