IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling and analysis on pass-through current decoupling method for multi-layer printed circuit board

Proceedings of 4th International Symposium on Electromagnetic Compatability

Author(s): Fujio, S. ; Kabayama, H. ; Sakurai, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Tokyo, Japan, Japan
Conference Date: 17 May 1999
Page(s): 365 - 368
ISBN (Paper): 4-9980748-4-9
DOI: 10.1109/ELMAGC.1999.801340
Regular:

It is well known that pass-through current, caused by the output buffer circuit of an IC during its transient state, can be a dominant source of the radiated field from the printed circuit board... View More

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