IEEE - Institute of Electrical and Electronics Engineers, Inc. - Using neural networks and 3D polynomial interpolation for the study of probe yield vs. E-test correlation. Application to sub-micronics mixed-signal technology

1999 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings

Author(s): Montull, J.I.A. ; Ortega, C. ; Sobrino, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Boston, Massachusetts, USA, USA
Conference Date: 8 September 1999
Page(s): 197 - 201
ISBN (Paper): 0-7803-5217-3
ISSN (Paper): 1078-8743
DOI: 10.1109/ASMC.1999.798222
Regular:

In the present paper we propose the use of neural networks for statistical modelling of data, as well as the use of 3D surface in order to visualise results in a very intuitive way. The scope of... View More

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