IEEE - Institute of Electrical and Electronics Engineers, Inc. - Integration for reduction of sub-half-micron center yield fallout

1999 IEEE/SEMI Advanced Semiconductor Manufacturing Conference and Workshop. ASMC 99 Proceedings

Author(s): Wing Kei Au ; Sappidi, J. ; Parks, D. ; Delgado, M. ; Kulkami, M. ; Costabile, M. ; Li, J. ; Gabriel, C.T. ; Wong, V. ; Levan, M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Boston, Massachusetts, USA, USA
Conference Date: 8 September 1999
Page(s): 18 - 20
ISBN (Paper): 0-7803-5217-3
ISSN (Paper): 1078-8743
DOI: 10.1109/ASMC.1999.798173
Regular:

This paper identifies and evaluates a new failure mechanism that preferentially suppresses the yield in the center of the wafer for deep submicron technologies. The problem is studied with sort... View More

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