IEEE - Institute of Electrical and Electronics Engineers, Inc. - Submicron CMOS thermal noise modeling from an RF perspective

1999 Symposium on VLSI Technology. Digest of Technical Papers

Author(s): J.J. Ou ; Xiaodong Jin ; Chenming Hu ; P.R. Gray
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Kyoto, Japan, Japan
Conference Date: 14 June 1999
Page Count: 2
Page(s): 151 - 152
ISBN (Paper): 4-930813-93-X
DOI: 10.1109/VLSIT.1999.799388
Regular:

Continuous scaling of submicron CMOS technologies will soon make low cost, wireless system-on-a-chip communication products possible. The ultimate goal of these systems is to integrate the entire... View More

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