IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel clustered hard mask technology for dual damascene multilevel interconnects with self-aligned via formation using an organic low k dielectric

1999 Symposium on VLSI Technology. Digest of Technical Papers

Author(s): N. Aoi ; E. Tamaoka ; M. Yamanaka ; S. Hirao ; T. Ueda ; M. Kubota
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Kyoto, Japan, Japan
Conference Date: 14 June 1999
Page Count: 2
Page(s): 41 - 42
ISBN (Paper): 4-930813-93-X
DOI: 10.1109/VLSIT.1999.799330
Regular:

A novel clustered hard mask technology with self-aligned via formation is developed. This technology provides dual damascene multilevel interconnects using an organic low k dielectric without via... View More

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