IEEE - Institute of Electrical and Electronics Engineers, Inc. - Copper post-CMP brush cleaning

Proceedings of the IEEE 1999 International Interconnect Technology Conference

Author(s): Elbel, N. ; Shumin Wang ; Sanger, A. ; Hadawi, D. ; Held, C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Francisco, CA, USA, USA
Conference Date: 26 May 1999
Page(s): 80 - 82
ISBN (Paper): 0-7803-5174-6
DOI: 10.1109/IITC.1999.787084
Regular:

Both metallic and abrasive particle cleaning after Cu CMP processing was studied. Two chemical (citric acid and K/sub 2/-EDTA) based cleaning systems were evaluated as functions of concentration... View More

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