IEEE - Institute of Electrical and Electronics Engineers, Inc. - Managing the interconnect continuum...from silicon to package and board

Proceedings of the IEEE 1999 International Interconnect Technology Conference

Author(s): Siu, B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Francisco, CA, USA, USA
Conference Date: 26 May 1999
Page(s): 3 - 5
ISBN (Paper): 0-7803-5174-6
DOI: 10.1109/IITC.1999.787061
Regular:

As VLSI technologies advance and performance of logic chips approaches 1 GHz, it is recognised that their performance is limited by the interconnect system. Furthermore, it is not just the... View More

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