IEEE - Institute of Electrical and Electronics Engineers, Inc. - 0.1 CC 60% efficiency power amplifier multi-chip modules for personal digital cellular phones

1999 IEEE MTT-S International Microwave Symposium Digest

Author(s): T. Saso ; Y. Hasegawa ; Y. Saito ; Y. Kakuta
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Anaheim, CA, USA, USA
Conference Date: 13 June 1999
Volume: 4
Page Count: 4
ISBN (Paper): 0-7803-5135-5
DOI: 10.1109/MWSYM.1999.780211
Regular:

0.1 cc high efficiency two-stage power amplifier multi-chip modules (PA MCM's) employing a novel resin multilayer printed circuit substrate and heterojunction FETs (HJFET's) has been successfully... View More

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