IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel three-dimensional vertical interconnect technology for microwave and RF applications

1999 IEEE MTT-S International Microwave Symposium Digest

Author(s): K. Goverdhanam ; R.N. Simons ; L.P.B. Katehi
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Anaheim, CA, USA, USA
Conference Date: 13 June 1999
Volume: 2
Page Count: 4
ISBN (Paper): 0-7803-5135-5
DOI: 10.1109/MWSYM.1999.779843
Regular:

In this paper, novel 3D interconnects suitable for applications in microwave and RF integrated circuit technology have been presented. The interconnect fabrication process and design details are... View More

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