IEEE - Institute of Electrical and Electronics Engineers, Inc. - A novel design concept for a super compact power amplifier module (SCPAM) using a multilayer substrate

1999 IEEE MTT-S International Microwave Symposium Digest

Author(s): M. Nishida ; S. Murai ; S. Banba ; T. Yamaguchi ; T. Sawai ; M. Sawada
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Anaheim, CA, USA, USA
Conference Date: 13 June 1999
Volume: 3
Page Count: 4
ISBN (Paper): 0-7803-5135-5
DOI: 10.1109/MWSYM.1999.779580
Regular:

This paper presents a novel circuit and layout design concept for a Super Compact Power Amplifier Module (SCPAM) using a multilayer substrate. This concept enables miniaturization of the module,... View More

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