IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal response of the ultra-performance BGA heat sink in ducted and unducted flow conditions...an experimental investigation
Proceedings of the Technical Program. ELECTRO 99
|Publisher:||IEEE - Institute of Electrical and Electronics Engineers, Inc.|
|Publication Date:||1 January 1999|
|Conference Location:||Boston, MA, USA, USA|
|Conference Date:||16 June 1999|
|Page(s):||125 - 136|
Discusses reasons for improvement. 1) More mass entering the heat sink due to a larger frontal area and hence increased heat transfer; 2) less pressure drop along the heat sink.