IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal response of the ultra-performance BGA heat sink in ducted and unducted flow conditions...an experimental investigation

Proceedings of the Technical Program. ELECTRO 99

Author(s): Tavassoli, B.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Boston, MA, USA, USA
Conference Date: 16 June 1999
Page(s): 125 - 136
ISBN (Paper): 0-7803-5475-3
DOI: 10.1109/ELECTR.1999.779351
Regular:

Discusses reasons for improvement. 1) More mass entering the heat sink due to a larger frontal area and hence increased heat transfer; 2) less pressure drop along the heat sink.

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