IEEE - Institute of Electrical and Electronics Engineers, Inc. - The implication of thermal compaction on hot forming technology for AMLCD glass

Proceedings of the 5th Asian Symposium on Information Display. ASID'99

Author(s): Shi-How Shieh ; Hsien-Hui Tai ; Hsiu-Chin Hsieh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Hsinchu, Taiwan, Taiwan
Conference Date: 19 March 1999
Page(s): 69 - 73
ISBN (Paper): 957-97347-9-8
DOI: 10.1109/ASID.1999.762716
Regular:

Silicate glass is the primary candidate for AMLCD substrates. Stringent pristine surface requirement has limited its commercial production to within a few companies, each of which uses different... View More

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