IEEE - Institute of Electrical and Electronics Engineers, Inc. - Vacuum packaging using anodic bonding and emission characteristics of FED

Proceedings of the 5th Asian Symposium on Information Display. ASID'99

Author(s): Duck-Jung Lee ; Byeong-Kwon Ju ; Jee-Won Jeong ; Hoon Kim ; Sung-Jae Jung ; Jin Jang ; Myung-Hwan Oh
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Hsinchu, Taiwan, Taiwan
Conference Date: 19 March 1999
Page(s): 53 - 56
ISBN (Paper): 957-97347-9-8
DOI: 10.1109/ASID.1999.762712
Regular:

In this paper, we suggest an FED packaging technology using the anodic bonding method. Amorphous silicon film deposited on glass was contacted with glass substrate followed by bonding. The... View More

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