IEEE - Institute of Electrical and Electronics Engineers, Inc. - Compact thermal models of conduction cooled packages

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. Proceedings 1999

Author(s): Ortega, A. ; Aranyosi, A. ; Griffin, R.A. ; West, S. ; Edwards, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 9 March 1999
Page(s): 221 - 230
ISBN (Paper): 0-7803-5264-5
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.1999.762452
Regular:

An extensive study was performed with the aim of developing compact thermal models of a variety of electronic packages used in conduction cooled scenarios. A nonredundant set of boundary... View More

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