IEEE - Institute of Electrical and Electronics Engineers, Inc. - Measurement and simulation of junction to board thermal resistance and its application in thermal modeling

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. Proceedings 1999

Author(s): Joiner, B. ; Adams, V.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 9 March 1999
Page(s): 212 - 220
ISBN (Paper): 0-7803-5264-5
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.1999.762450
Regular:

The junction-to-board thermal resistance, /spl theta//sub JB/ or theta JB, is a figure of merit for the thermal performance of surface mount integrated circuit packages relative to the printed... View More

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