IEEE - Institute of Electrical and Electronics Engineers, Inc. - Generation and verification of boundary independent compact thermal models for active components according to the DELPHI/SEED methods

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. Proceedings 1999

Author(s): Pape, H. ; Noebauer, G.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 9 March 1999
Page(s): 201 - 211
ISBN (Paper): 0-7803-5264-5
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.1999.762449
Regular:

In the European project SEED (Supplier Evaluation and Exploitation of DELPHI), methods for thermal characterization of active components developed in DELPHI were evaluated by component suppliers.... View More

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