IEEE - Institute of Electrical and Electronics Engineers, Inc. - Junction-to-top and junction-to-board thermal resistance measurement for 119 BGA packages

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. Proceedings 1999

Author(s): Chung, T. ; Kim, M. ; Baek, J. ; Oh, S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 9 March 1999
Page(s): 142 - 150
ISBN (Paper): 0-7803-5264-5
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.1999.762441
Regular:

Junction-to-top (/spl theta//sub jt/) and junction-to-board (/spl theta//sub jb/) thermal resistance of a 119 BGA package for 4 Mbit SP SRAM have been investigated using the cold plate-Teflon... View More

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