IEEE - Institute of Electrical and Electronics Engineers, Inc. - Measurements of adhesive bondline effective thermal conductivity and thermal resistance using the laser flash method

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. Proceedings 1999

Author(s): Campbell, R.C. ; Smith, S.E. ; Dietz, R.L.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 9 March 1999
Page(s): 83 - 97
ISBN (Paper): 0-7803-5264-5
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.1999.762433
Regular:

Thermal modeling of device packages requires accurate thermophysical property data for package materials. Accurate data for the thermal resistance of the adhesive bondline used to attach a high... View More

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