IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal impact of solder voids in the electronic packaging of power devices

Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. Proceedings 1999

Author(s): Zhu, N.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: San Diego, CA, USA, USA
Conference Date: 9 March 1999
Page(s): 22 - 29
ISBN (Paper): 0-7803-5264-5
ISSN (Paper): 1065-2221
DOI: 10.1109/STHERM.1999.762424
Regular:

The subject of this paper is the thermal impact of solder voids in the electronic packaging of semiconductor power devices. First, the pros and cons of some conventional methods used in thermal... View More

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