IEEE - Institute of Electrical and Electronics Engineers, Inc. - Adhesion studies of model epoxy systems and commercial underfill resins

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Pearson, R.A. ; Komnopad, P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 344 - 350
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757336
Regular:

The fracture behavior of model epoxy systems and commercial underfill resins for flip chip assembly solder joint encapsulation has been studied. In some cases, the energy dissipation mechanisms... View More

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