IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development and characterization of imidazole derivative cured bisphenol A epoxy materials for flip-chip underfill applications

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Shi, S.H. ; Yamashita, T. ; Wong, C.P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 317 - 324
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757332
Regular:

This paper aims to provide underfill manufacturers and electronic packaging companies with general information about imidazole derivative cured bisphenol A epoxy materials. Four selected imidazole... View More

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