IEEE - Institute of Electrical and Electronics Engineers, Inc. - Novel conductive adhesives for surface mount applications

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Daoqiang Lu ; Wong, C.P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 288 - 294
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757328
Regular:

Electrically conductive adhesives (ECAs) have been explored as a SnPb solder alternative for attaching encapsulated surface mount components on rigid and flexible printed circuits. However,... View More

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