IEEE - Institute of Electrical and Electronics Engineers, Inc. - Flip chip packaging

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Werner, R.G. ; Frear, D.R. ; DeRosa, J. ; Sorongon, E.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 246 - 251
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757321
Regular:

Some of the needs for improved performance can be met with versions of the packaging solutions that have been developed over the last 5-10 years. These solutions have typically focused on... View More

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