IEEE - Institute of Electrical and Electronics Engineers, Inc. - CSP present and future

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Magill, P.A. ; Baggs, J.W.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 218 - 220
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757315
Regular:

Chip scale packaging offers an attempt to bridge the manufacturing gulf between what has been done in the past with perimeter leaded wire-bonded packaging and what is and will be done in the... View More

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