IEEE - Institute of Electrical and Electronics Engineers, Inc. - MCM-D/C packaging solution for IBM latest S/390 servers

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Perfecto, E.D. ; Shields, R.R. ; Jeanneret, M.P. ; Malhotra, A.K. ; McHerron, D.C.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 209 - 213
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757313
Regular:

The G5, fastest member of the S390 server family, was announced in May of 1998. The multichip module (MCM) used consists of 29 CMOS chips on a 127.5 mm glass ceramic substrate with 6 levels of... View More

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