IEEE - Institute of Electrical and Electronics Engineers, Inc. - Modeling ceramic filled polymer integrated capacitor formation using neural networks

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Thongvigitmanee, T. ; May, G.S.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 174 - 177
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757307
Regular:

Integrated decoupling capacitors for MCM-L/D technology are an important component for next-generation electronic packaging applications. This paper presents a statistically designed experiment... View More

Advertisement