IEEE - Institute of Electrical and Electronics Engineers, Inc. - Aluminum nitride packaging

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Ishida, M. ; Hasegawa, T. ; Iwaida, T. ; Knudsen, A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 133 - 135
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757300
Regular:

Due to its high thermal conductivity (TC) and a low thermal expansion coefficient, which is comparable to that of Si, aluminum nitride (AlN) has been adopted for packages requiring high thermal... View More

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