IEEE - Institute of Electrical and Electronics Engineers, Inc. - Thermal engineering of electronics packages using CVD diamond

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Fabis, P.M.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 125 - 132
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757299
Regular:

CVD diamond substrates were: (a) plastic packaged as SOIC GaAs MESFET (chip and wire, flip chip) and PQFP GaAs PHEMT devices, and (b) as CuW-flanged ceramic packaged with Si LDMOS devices. The... View More

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