IEEE - Institute of Electrical and Electronics Engineers, Inc. - Initial investigations into low-cost ultra-fine pitch solder printing process based on innovative laser printing technology

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Walker, A. ; Baldwin, D.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 100 - 105
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757295
Regular:

Advances in electronics packaging and assembly technology are driving increased demand for ultra-fine pitch solder deposition. In this work, innovative solder deposition techniques based on laser... View More

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