IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development and application by ink-jet printing of advanced packaging materials

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Hayes, D.J. ; Grove, M.E. ; Cox, W.R.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 88 - 93
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757293
Regular:

High temperature ink-jet based printing processes (MicroJet) and custom polymer formulations have been developed for use in the fabrication of high-density microelectronic and optoelectronic... View More

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