IEEE - Institute of Electrical and Electronics Engineers, Inc. - Effect of oxidation on mold compound-copper leadframe adhesion

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Berriche, R. ; Vahey, S.C. ; Gillett, B.A.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 77 - 82
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757291
Regular:

The effect of oxidation on adhesion between a mold compound and copper leadframe material was investigated for OCN and DCP molding compounds and one copper alloy. The oxidation temperatures... View More

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