IEEE - Institute of Electrical and Electronics Engineers, Inc. - Challenges in the packaging of MEMS

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): O'Neal, C.B. ; Malshe, A.P. ; Singh, S.B. ; Brown, W.D. ; Eaton, W.P.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 41 - 47
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757284
Regular:

Unlike IC packaging, MEMS dice must interface with the environment for sensing, interconnection, and/or actuation. MEMS packaging is application specific and the package provides the physical... View More

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