IEEE - Institute of Electrical and Electronics Engineers, Inc. - Development of solderless joining technologies using conductive adhesives

Proceedings International Symposium on Advanced Packaging Materials. Processes, Properties and Interfaces

Author(s): Takezawa, H. ; Itagaki, M. ; Mitani, T. ; Bessho, Y. ; Eda, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1999
Conference Location: Braselton, GA, USA, USA
Conference Date: 14 March 1999
Page(s): 11 - 15
ISBN (Paper): 0-930815-56-4
DOI: 10.1109/ISAPM.1999.757279
Regular:

A solderless joining technique using a new Ni-type conductive adhesive was developed. First, the electrical performance was evaluated using a practical module. The delay time and output voltage of... View More

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