IEEE - Institute of Electrical and Electronics Engineers, Inc. - Finite element modeling of 3D interconnection structures

Proceedings of International Conference on Microwave and Millimeter Wave Technology

Author(s): Jilin Tan ; Guangwen Pan
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Beijing, China, China
Conference Date: 18 August 1998
Page(s): 957 - 960
ISBN (Paper): 0-7803-4308-5
DOI: 10.1109/ICMMT.1998.768448
Regular:

Three dimensional interconnection structures are modeled by an edge based finite element method. The corresponding boundary conditions at the planes of incidence and transmittance for hybrid modes... View More

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