IEEE - Institute of Electrical and Electronics Engineers, Inc. - ELO bonding of GaAs devices on diamond film SAW devices

1998 IEEE Ultrasonics Symposium. Proceedings

Author(s): Koh, K. ; Takabatake, N. ; Noge, S. ; Kobayashi, T. ; Arai, T. ; Hohkawa, K.
Publisher: IEEE - Institute of Electrical and Electronics Engineers, Inc.
Publication Date: 1 January 1998
Conference Location: Sendai, Japan, Japan
Conference Date: 5 October 1998
Volume: 1
ISBN (Paper): 0-7803-4095-7
ISSN (Paper): 1051-0117
DOI: 10.1109/ULTSYM.1998.762157
Regular:

This paper reports a basic study on the integration of diamond film with GaAs devices. We investigated the roughness of the diamond film surface by AFM and estimated the thermal conductivity of... View More

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